Optoelectronic Multi-chip Modules
نویسندگان
چکیده
In this paper, we present a novel packaging architecture for Optoelectronic Multi-Chip-Modules (OEMCM) based on fiber image guides. Fiber image guides (FIGs) are densely packed lattices of small core fibers that have been traditionally used in medical endoscopes and other remote inspection devices. In our chip packaging architecture, small, rigid segments of FIGs are used to fabricate 3D optical elements with OE chips directly bonded to the outside surfaces. We present several example designs and describe a proof of concept prototype.
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